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Japan Intellectual Property Rights: METHOD FOR MANUFACTURING RESIN PLATING MATERIAL, AND ELECTROLESS PLATING DEVICE

Japan, April 22 -- USHIO INC has got intellectual property rights for 'METHOD FOR MANUFACTURING RESIN PLATING MATERIAL, AND ELECTROLESS PLATING DEVICE.' Other related details are as follows: Applicat... Read More


Japan Intellectual Property Rights: MIST BLOWER

Japan, April 22 -- MAKITA CORP has got intellectual property rights for 'MIST BLOWER.' Other related details are as follows: Application Number: JP,2022-108451 Category (FI): A01M7/00@M Stage: Gran... Read More


Japan Intellectual Property Rights: MEMS MIRROR AND MEMS MIRROR ARRAY SYSTEM

Japan, April 22 -- ROHM CO LTD has got intellectual property rights for 'MEMS MIRROR AND MEMS MIRROR ARRAY SYSTEM.' Other related details are as follows: Application Number: JP,2021-190008 Category ... Read More


Japan Intellectual Property Rights: NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, LITHIUM ION SECONDARY BATTERY, AND MANUFACTURING METHOD FOR NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY

Japan, April 22 -- JAPAN ADVANCED INSTITUTE OF SCIENCE & TECHNOLOGY HOKURIKU has got intellectual property rights for 'NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, LITHIUM ION SECOND... Read More


Japan Intellectual Property Rights: LIQUID EJECTING SYSTEM AND HEAD UNIT

Japan, April 22 -- SEIKO EPSON CORP has got intellectual property rights for 'LIQUID EJECTING SYSTEM AND HEAD UNIT.' Other related details are as follows: Application Number: JP,2021-170339 Category... Read More


Japan Intellectual Property Rights: METAL MEMBER, METAL-RESIN JOINED BODY, AND PRODUCTION METHODS THEREFOR

Japan, April 22 -- NIPPON LIGHT METAL CO LTD has got intellectual property rights for 'METAL MEMBER, METAL-RESIN JOINED BODY, AND PRODUCTION METHODS THEREFOR.' Other related details are as follows: A... Read More


Japan Intellectual Property Rights: SEMICONDUCTOR CHIPS, CHIP MODULES, AND METHODS OF MAKING SEMICONDUCTOR CHIPS (SEMICONDUCTOR CIRCUIT POWER DELIVERY)

Japan, April 22 -- INTERNATIONAL BUSINESS MASCHINES CORPORATION has got intellectual property rights for 'SEMICONDUCTOR CHIPS, CHIP MODULES, AND METHODS OF MAKING SEMICONDUCTOR CHIPS (SEMICONDUCTOR CI... Read More


Japan Intellectual Property Rights: MOLDED BODY, AUTOMOBILE MEMBER, AND METHOD FOR MANUFACTURING MOLDED BODY

Japan, April 22 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'MOLDED BODY, AUTOMOBILE MEMBER, AND METHOD FOR MANUFACTURING MOLDED BODY.' Other related details are as follows: App... Read More


Japan Intellectual Property Rights: VEHICLE RECORDING DEVICE

Japan, April 22 -- DENSO CORP has got intellectual property rights for 'VEHICLE RECORDING DEVICE.' Other related details are as follows: Application Number: JP,2022-154047 Category (FI): H04N7/18@U,... Read More


Japan Intellectual Property Rights: SILICON OXYNITRIDE-CONTAINING COMPOSITION, HEAT-RADIATING RESIN COMPOSITION, AND HEAT-RADIATING RESIN COMPOSITION FILM SHEET INCLUDING THE SAME

Japan, April 22 -- UBE CORP has got intellectual property rights for 'SILICON OXYNITRIDE-CONTAINING COMPOSITION, HEAT-RADIATING RESIN COMPOSITION, AND HEAT-RADIATING RESIN COMPOSITION FILM SHEET INCLU... Read More